GS600SWA wafer-level dispensing machine x 2
GS600SWB wafer-level dispensing machine x 2
PC100 wafer loading & unloading machine x 1
WxDxH : 3200x 4000x 2200mm
Supporting 12-inch wafer dispensing.
Dustproof level 10, meeting the environmental requirements of wafer level packaging.
High ESD standard, above IEC and ANSI standards.
In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process needs while ensuring the product safety.
The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis.
CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence
Triple Low-Level Alarm
Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue
Vacuum Adsorption Heating Fixture
The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation
The vacuum suction fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture
Platform-Type Loading & Unloading System
The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
Friendly human-machine interface design
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects
Work positions are inspected before and after operation, and the final station is professionally inspected to achieve multiple fool proof.
The on-line mode is used to minimize manual intervention.
Prevention of Whole Line Downtime
Operation/conveyor tracks are separated,so that shutdown of a single machine does not affect the operation of the whole line.
Meeting Information Management Requirements
Real-time MES system docking, upload of production status information, and system abnormal status alarm.Supporting SECS/GEM semiconductor communication protocol.
Meeting Stringent Engineering Requirements
Class-100 dustproof design (modeling and simulation, dust-proof components and cables, and gas filtration, etc.). ESD prevention design (in accordance with IEC61340 and ANSI/ESDS20.20 standards).Anti-vibration (mineral frame and good shock absorption to effectively reduce the impact caused by high-speed movement).